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Development History
20013 TO PRESENT
2013
Shenzhen Shenghe Precision Mold Co., Ltd. was founded.
2015
Developed semiconductor injection molds and compression molding molds, further improving resin packaging technology by leaps and bounds.
2017
The demand for semiconductor packaging increases, and Shenghe develops into high-end precision and begins to enter the international market.

2019
Won the honor from the Enterprise Information Office
2020
Shenzhen Semiconductor Manufacturing Exhibition was a complete success
2021
Won the membership unit of semiconductor industry
2023
Shenghe Precision made a shining appearance at the 5th Shenzhen International Semiconductor Technology and Application Exhibition.
Since its establishment in 2013, it has been adhering to the goal of pursuing novelty and innovation, always adhering to the credibility purpose of surviving on quality, and embarking on a path of aggressiveness, steady and rapid development. We focus on product quality and delivery, and have won widespread praise and customer groups with excellent product quality. It has strong processing capabilities and excellent technical talents, and welcomes new opportunities and challenges in the industry with an enterprising spirit. Production is carried out in strict accordance with the ISO9001 quality management system and ISO14001 environmental management system.